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SEMI showcases Conductor intelligence platform for enhanced global supply chain collaboration

India, Sept. 12 -- SEMI has announced its new Conductor intelligence platform for enhanced supply chain management at SEMICON Taiwan. The platform was developed as part of the SEMI Supply Chain Mana... Read More


From startups to giants: SEMICON India 2025 brings semiconductor world to India

India, Sept. 12 -- SEMICON India 2025 Exhibition, the centrepiece of India's semiconductor calendar, concluded with resounding success, achieving record participation and unprecedented scale. Doubling... Read More


TCS unveils chiplet-based system engineering services to accelerate semiconductor innovation

India, Sept. 12 -- Tata Consultancy Services (TCS) announced the launch of its chiplet-based system engineering services, designed to help semiconductor companies push the boundaries of traditional ch... Read More


Honeywell intros all-in-one battery energy storage automation platform

India, Sept. 12 -- Honeywell has introduced the Honeywell Ionic Modular All-in-One, a compact, end-to-end battery energy storage system (BESS) designed for the commercial and industrial segments. By... Read More


Deca and Silicon Storage announce strategic collaboration to enable NVM chiplet solutions

India, Sept. 12 -- As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases. Deca Te... Read More


How the HIRE Act, a proposed 25% US outsourcing tax, threatens India's IT

India, Sept. 10 -- A new US Senate proposal, the Halting International Relocation of Employment (HIRE) Act, threatens to upend India's USD 224 billion IT export market. With a proposed 25% excise tax ... Read More


SAL receives Applied Materials PECVD tool for 200mm dielectrics thin films deposition

India, Sept. 10 -- Silicon Austria Labs (SAL) has received its Centura PECVD tool from Applied Materials, supporting dielectrics deposition for RF circulators on 200mm wafers. The tool is in commissio... Read More


AGC participating in "JOINT3" Consortium to develop next-gen semiconductor packaging

India, Sept. 10 -- AGC Inc. has joined the "JOINT3" Consortium to develop next-generation semiconductor packaging. JOINT3 is a co-creation evaluation framework established by Resonac, with the aim of... Read More


3DIC Advanced Packaging Manufacturing Alliance to become a force

India, Sept. 10 -- SEMICON Taiwan 2025 will debut in September. With the sharp increase in demand for AI chips and HPC, the global semiconductor industry is ushering in a new generation of advanced pa... Read More


Top 10 jobs most likely to be replaced by AI by 2030: AI Automation Risk Report

India, Sept. 10 -- Artificial Intelligence (AI) is no longer a futuristic concept -it is already influencing industries, transforming economies, and redefining the global workforce. According to recen... Read More